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Thermal management of electronics and optical devices entails removing large thermal loads from small areas and in confined volumes. Our modeling tools are used to develop solutions for leading edge issues in this area.
One project entailed development of a novel approach to removing very large heat fluxes from an array of high power laser arrays. Detailed numerical modeling of a number of design candidates revealed that the traditional cooling approaches could not be extended to the new thermal loads. Alternative cooling systems were investigated and a number of optimal configurations were selected prototype testing.
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